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The Assessment of the Corrosivity of Soldering Flux Residues Using Printed Copper Circuit Board Tracks

D. Bono (Consultant, Paris, France)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 February 1989

51

Abstract

Following a review of the methods used in the electronics industry to study the corrosivity of fluxes for soft soldering, two procedures have been developed based on a proposal published by W. Rubin and B.M. Allen. In the first test, the loss in strength of anodically polarised copper wires coated with soldering flux residues is measured after exposure to humid conditions for 24 hours. The second test uses a printed circuit board carrying a copper track test pattern which is coated with soldering flux residues and held in a humid environment. Tracks on the test circuit are polarised anodically at 250 V and changes in their electrical conductivity are monitored. These give an indication of the progress of corrosion through a ‘corrosion factor’, Fc(t), derived from:

Citation

Bono, D. (1989), "The Assessment of the Corrosivity of Soldering Flux Residues Using Printed Copper Circuit Board Tracks", Soldering & Surface Mount Technology, Vol. 1 No. 2, pp. 22-29. https://doi.org/10.1108/eb037673

Publisher

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MCB UP Ltd

Copyright © 1989, MCB UP Limited

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