New Products

Abstract

Heraeus of Hanau, W. Germany, have introduced a new solder paste (Series SC 3300), designed for SM technology. Heraprint and Cermalloy solder paste formulations eliminate the formulation of solder balls during reflow, thus assuring very high yields. The organic system in these materials prevents crusting and viscosity changes while providing rheology characteristics which allow improved screen printing resolution.

Citation

(1989), "New Products", Soldering & Surface Mount Technology, Vol. 1 No. 1, pp. 76-78. https://doi.org/10.1108/eb037669