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The Strength of Soldered Joints on Surface Mounted Devices

E.E. de Kluizenaar (Nederlandse Philips Bedrijven BV, SMD Technology Centre, Eindhoven, The Netherlands)
M.M.F. Verguld (Nederlandse Philips Bedrijven BV, SMD Technology Centre, Eindhoven, The Netherlands)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1989

31

Abstract

Strength measurements of soldered joints in electronics are widely used for the assessment of joint quality. However, a variety of experiments, reported in this article, clearly show that a strong relationship between initial strength and joint quality does not exist. Far more important for joint reliability is the resistance of soldered constructions to low‐cycle fatigue of the solder metal, caused by thermal expansion differences upon temperature cycling during use. A temperature cycling test is proposed as a standard accelerated ageing method for the prediction of the low‐cycle fatigue life of soldered joints in electronics.

Citation

de Kluizenaar, E.E. and Verguld, M.M.F. (1989), "The Strength of Soldered Joints on Surface Mounted Devices", Soldering & Surface Mount Technology, Vol. 1 No. 1, pp. 52-57. https://doi.org/10.1108/eb037664

Publisher

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MCB UP Ltd

Copyright © 1989, MCB UP Limited

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