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Effect of Natural Ageing on the Mechanical Properties of the Soldered Joint Used in the Electronics Industry

S.S. Ahluwalia (International Tin Research Institute, Uxbridge, Middlesex, England Formerly with the International Tin Research Institute, now with G.E.C. Marconi, Research Centre, Chelmsford.)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 1 January 1989

33

Abstract

Joints made to the Surface Mount configuration for a chip capacitor using either 60Sn40Pb or 62Sn36Pb2Ag solders were found to weaken substantially during storage at room temperature. This loss in joint strength is attributed to microstructural changes in the solder, particularly precipitation of the β phase and recrystallisation of the matrix, i.e., the two solid solutions (α + β), and the subsequent coarsening of the microstructure.

Citation

Ahluwalia, S.S. (1989), "Effect of Natural Ageing on the Mechanical Properties of the Soldered Joint Used in the Electronics Industry", Soldering & Surface Mount Technology, Vol. 1 No. 1, pp. 43-46. https://doi.org/10.1108/eb037662

Publisher

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MCB UP Ltd

Copyright © 1989, MCB UP Limited

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