Heat Transfer Fluids for Vapour Phase Soldering — An Appraisal

Abstract

The success of vapour phase soldering for electronic assemblies has led to the availability of several heat transfer fluids for the purpose. This paper aims to demonstrate the significance of the differing properties of fluids, illustrated by measurements on the three most commonly used in the UK. These three, as well as any future fluids, can be judged in terms of (i) vapour temperature and its influence on soldering yields and materials properties; (ii) stability of soldering temperature with time; (iii) heat transfer efficiency; (iv) power requirements and thermal control; (v) rosin solubility and flux wash‐off; (vi) toxicity, especially under thermal stress; (vii) corrosivity and its dependence on process control; and (viii) consumption of fluid.

Citation

Lea, C. (1989), "Heat Transfer Fluids for Vapour Phase Soldering — An Appraisal", Soldering & Surface Mount Technology, Vol. 1 No. 1, pp. 23-32. https://doi.org/10.1108/eb037661