Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction
W. Engelmaier
(AT&T Bell Laboratories, Whippany, New Jersey, USA)
220
Abstract
In this paper an overview of the issues underlying surface mount solder joint long‐term reliability is presented. The paper gives state‐of‐the‐art solutions for ‘Design for Reliability’ in simple design tool form, discusses the important accelerated reliability test issues, and provides the equations to estimate the reliability of SM product in use as well as the expected cyclic life in accelerated tests.
Citation
Engelmaier, W. (1989), "Surface Mount Solder Joint Long‐term Reliability: Design, Testing, Prediction", Soldering & Surface Mount Technology, Vol. 1 No. 1, pp. 14-22. https://doi.org/10.1108/eb037660
Publisher
:MCB UP Ltd
Copyright © 1989, MCB UP Limited