Computer code complex for the thermal oxidation of silicon is presented. There are one‐dimensional model and two‐ dimensional models:the model of viscoelastic oxide and the hydrodynamical models — an ideal fluid and a viscous fluid models. If nitride mask is absent, a one‐dimensional model is used.The influence of an induced stress on the diffusion and reaction is taken into account.
Gadiyak, G.V., Korobitsina, J.L. and Kranarenko, V.I. (1992), "NUMERICAL SIMULATION OF THE THERMAL OXIDATION OF SILICON", COMPEL - The international journal for computation and mathematics in electrical and electronic engineering, Vol. 11 No. 4, pp. 419-431. https://doi.org/10.1108/eb010103Download as .RIS
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