To read this content please select one of the options below:

Adhesives aid robotic bonding of flexible circuits

Alastair Ross (IBM, Havant, Hampshire, UK)

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 April 1988

33

Abstract

THE USE of engineering adhesives in manufacturing is seen to be a major area of growth, at the expense of conventional fastening techniques such as screwing, welding and riveting. Similarly, flexible circuits are also seen to be set to grow in use as manufacturers seek to cram in more electronics and functions into ever‐smaller and more complex packages.

Citation

Ross, A. (1988), "Adhesives aid robotic bonding of flexible circuits", Assembly Automation, Vol. 8 No. 4, pp. 189-193. https://doi.org/10.1108/eb004244

Publisher

:

MCB UP Ltd

Copyright © 1988, MCB UP Limited

Related articles