Surface mounting spurs automation

Abstract

Over the past year, the pattern in assembly of electronics components to printed circuit boards (PCBs) has changed dramatically, with far greater use of surface mounted devices (SMDs) in place of through‐hole insertion of leaded devices. Therefore, most of the established makers of machinery have introduced special placement equipment. However, the Japanese were slow to introduce the vapour phase soldering needed for surface mounting, but now equipment, claimed to overcome the weaknesses of the early machines, is available.

Citation

Hartley, J. (1987), "Surface mounting spurs automation", Assembly Automation, Vol. 7 No. 2, pp. 85-88. https://doi.org/10.1108/eb004213