Super Dry expands oxidation free MSD & PCB drying alternatives

Circuit World

ISSN: 0305-6120

Article publication date: 11 May 2012



(2012), "Super Dry expands oxidation free MSD & PCB drying alternatives", Circuit World, Vol. 38 No. 2.



Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

Super Dry expands oxidation free MSD & PCB drying alternatives

Article Type: New products From: Circuit World, Volume 38, Issue 2

“Moisture Sensitive Device specialist and manufacturer of ultra low humidity chambers, has expanded their advanced series of oxidation free drying and storage systems including new features and new price/performance configurations”.

Designed to exceed the formidable challenges associated with IPC J-STD-033B.1 for handling moisture sensitive devices, the XSD series desiccant cabinets offer a process combining ultra low humidity and mild temperatures proven to replace vacuum oven baking of taped on reel components at a fraction of the cost. IPC 1601 prohibits the baking of OSP coated boards, and warns against baking any board types. The Super Dry XSD cabinets can dry PCBs and other moisture sensitive devices at high speeds without the oxidation and inter-metallic growth induced by baking. And, unlike vacuum or baking ovens, the XSD cabinets also offer cost-effective long term and short term MSD safe storage solutions in full compliance with 033B.1 specifications.

The XSD cabinet series has been expanded with two additional configurations that employ a unique, energy saving dual wall insulated steel and glass design and the U5002 “Dynamic Series” closed loop dehumidification. Optimal humidity levels are below 0.5 per cent RH and vapor content of less than 0.6 g m3. Recovery time after door openings, the most overlooked operational function of MSD storage systems, is unmatched at <240 s. In addition, their unique design regenerates only when necessary according to cabinet load, thereby further reducing energy consumption, which averages less than 30 W/h.

Oxidation has always been a very significant drawback of baking components, and in fact even a single bake cycle at typical 125° temperatures will significantly increase wetting times. The Super Dry process dramatically reduces this oxidation risk, because it employs mild, low heat delivered within an exceptionally dry atmosphere. The oxygen molecules in water are a much greater catalyst to the oxidation process than those in the air. So heating at the sub-0.5 per cent RH levels the XSD is capable of achieving does not promote the oxidation common to traditional processes. And furthermore, 50°C is safe for tapes and reels, enabling drying of taped component without damage. This fully eliminates the cost and logistics of removing components from tape prior to drying, then re-taping for subsequent production use.

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