MFLEX and AT&S launch strategic alliance to jointly manufacture high density interconnect rigid-flex printed circuits

Circuit World

ISSN: 0305-6120

Article publication date: 11 May 2012

180

Citation

(2012), "MFLEX and AT&S launch strategic alliance to jointly manufacture high density interconnect rigid-flex printed circuits", Circuit World, Vol. 38 No. 2. https://doi.org/10.1108/cw.2012.21738baa.006

Publisher

:

Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited


MFLEX and AT&S launch strategic alliance to jointly manufacture high density interconnect rigid-flex printed circuits

Article Type: Industry news From: Circuit World, Volume 38, Issue 2

Multi-Fineline Electronix, Inc. and AT&S Austria Technologie & Systemtechnik Aktiengesellschaft have announced a Strategic Alliance Agreement between the two parties. The resulting alliance will enable the parties to offer best-in-class high density interconnect (HDI) rigid-flex printed circuits for electronic devices and positions both companies to tap new opportunities in additional applications beyond their current offerings.

Rigid-flex circuits are hybrid constructions consisting of rigid and flexible substrate sections that are laminated together into a single structure. HDI rigid-flex printed circuits integrate HDI PCB technology used for high density components with three dimensional flex circuits packaging solutions, eliminating connectors and thereby saving space and weight.

Both companies will continue to pursue increasing market opportunities in their core business, while providing this sophisticated solution as an addition to their product offerings. The alliance allows OEM’s to fully utilize MFLEX and AT&S’s expertise in complex flexible circuits and HDI rigid printed circuit board technology, respectively, to create technology demanding solutions for HDI rigid-flex printed circuits.

For further information, please visit the web site: www.ats.net

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