AT&S and MFLEX launch strategic alliance

Circuit World

ISSN: 0305-6120

Article publication date: 11 May 2012



(2012), "AT&S and MFLEX launch strategic alliance", Circuit World, Vol. 38 No. 2.



Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

AT&S and MFLEX launch strategic alliance

Article Type: Industry news From: Circuit World, Volume 38, Issue 2

AT&S and MFLEX, a global leader in flex circuit fabrication with complex electronic component assembly capabilities announced a Strategic Alliance Agreement between the two parties. The resulting alliance will enable the parties to offer best-in-class high density interconnect (HDI) rigid-flex printed circuits for electronic devices and positions both companies to tap new opportunities in additional applications beyond their current offerings.

Rigid-flex circuits are hybrid constructions consisting of rigid and flexible substrate sections that are laminated together into a single structure. HDI rigid-flex printed circuits integrate HDI PCB technology used for high density components with three dimensional flex circuits packaging solutions, eliminating connectors and thereby saving space and weight.

“As global technology leaders, AT&S and MFLEX are leveraging the strengths of each company to jointly manufacture best-in-class HDI rigid-flex printed circuits with assembly capabilities to meet the market needs for complex interconnect solutions. Having commenced initial production of HDI rigid-flex printed circuits, we are excited by the new business prospects this alliance opens to both companies as we expand into new applications with advanced technology products to serve both existing and new customers,” said MFLEX CEO Reza Meshgin.

“We are excited about the synergy between MFLEX’s core strength in flex circuits and assemblies and AT&S’s core strength in HDI printed circuit board technology to bring HDI rigid-flex printed circuits to market. This cooperation is another important step in our strategy to become an industry leader for technology and innovation. To our customers, this alliance offers new opportunities in design and applications,” said AT&S CEO Andreas Gerstenmayer.

AT&S places EUR 100 million corporate bond

In November 2011 the AT&S Group successfully issued a EUR 100 million corporate bond with a maturity of five years and a coupon of 5 per cent in Austria. The bond was fully subscribed for in an extremely short period of time by a mix of institutional and private investors. 55 per cent of the investment volume was accounted for by private investors of the group, 43 per cent by institutional investors and the remaining two per cent by asset managers.

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