Latest BPA report on flex and flex-rigid PCB markets

Circuit World

ISSN: 0305-6120

Article publication date: 3 February 2012



(2012), "Latest BPA report on flex and flex-rigid PCB markets", Circuit World, Vol. 38 No. 1.



Emerald Group Publishing Limited

Copyright © 2012, Emerald Group Publishing Limited

Latest BPA report on flex and flex-rigid PCB markets

Article Type: Industry news From: Circuit World, Volume 38, Issue 1

BPA’s latest report on the markets and technologies for flexible and rigid-flex printed circuits forecasts that the global market for bareboard flex will increase from $8.6 billion to $12.7 billion by 2016 with China the single largest FPC-producing country accounting for approximately one quarter of total Asian production value in 2010. While new applications for flex such as smart card displays, tablet computers, biometric sensors, LED lighting and wireless communication antenna (this last applicable to all market sectors) are all strong growth markets, the dominant end-market is and will continue to be mobile phones and smartphones. Here, the preferred mobile phone form factor has shifted away from clamshell and slider to touchscreen display, and as data transmission rates increase with sensor and display resolution, so FPC and rigid-flex technologies are changing and advancing.

BPA’s report focuses on all the key applications in each market sector to see what is driving the market forward and what will be required in future. Market forecasts are provided for each major region by technology and by application. Opportunities are identified for fabricators, equipment and material suppliers.

Report Price: £3,000/€3,250/$4,500

For more information, please contact at: or

Related articles