Polar Instruments appoints Neil Chamberlain as Signal Integrity Product Manager

Circuit World

ISSN: 0305-6120

Article publication date: 8 February 2011

41

Citation

(2011), "Polar Instruments appoints Neil Chamberlain as Signal Integrity Product Manager", Circuit World, Vol. 37 No. 1. https://doi.org/10.1108/cw.2011.21737aab.011

Publisher

:

Emerald Group Publishing Limited

Copyright © 2011, Emerald Group Publishing Limited


Polar Instruments appoints Neil Chamberlain as Signal Integrity Product Manager

Article Type: Appointments From: Circuit World, Volume 37, Issue 1

Polar Instruments have appointed Neil Chamberlain as Signal Integrity Product Manager, in addition to his existing role as European Sales Manager.

Chamberlain will take responsibility for bringing Polar’s new and updated portfolio of signal integrity products to customers throughout the world. A vital part of the launch process for these products will be the dialogue with lead customers which will help to ensure a smooth transition from the release of the engineering version to full roll-out into the marketplace.

“Channelling and prioritising feedback during the launch phase of a new product or product upgrade is vital”, states Chamberlain. “I will be talking extensively to customers to ensure that the products provide easy and cost-effective answers to the real-world signal integrity issues faced by OEM designers and PCB fabricators”.

Polar’s CEO, Martyn Gaudion, adds; “Having been with Polar for ten years, Chamberlain has extensive experience in the PCB layout and fabrication process. This experience will help customers to address the emerging trend towards multi-GHz PCBs which is imposing new benchmarks for signal integrity”.

As part of a continual development process, Polar Instruments has recently extended the functionality of the Speedstack PCB layer stack-up design system with the introduction of a Virtual Material Mode which allows PCB layers to be designed without reference to material libraries. The addition of the Speedflex controlled impedance layer stackup design system for flex-rigid PCBs to the Speedstack system is another product milestone and further product updates are planned for 2011.

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