“Innovation field” package

Circuit World

ISSN: 0305-6120

Article publication date: 20 November 2009

59

Citation

(2009), "“Innovation field” package", Circuit World, Vol. 35 No. 4. https://doi.org/10.1108/cw.2009.21735dac.005

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited


“Innovation field” package

Article Type: Conferences and exhibitions From: Circuit World, Volume 35, Issue 4

Messe München has now introduced the “Innovation Field” Package, an attractive stand offer tailored precisely to the needs of these exhibitors. This package is aimed at all potential exhibitors and contains a preferential placement in the focus areas of the trade fair. Both young companies and international industry leaders will present their trade fair innovations in these special exhibition fields. The range of topics will include the innovation areas of photovoltaic manufacturing, micronano production, organic electronics, hybrid-component manufacturing (all in hall B3) and electronic manufacturing services (EMS Village, exhibition hall A1). Designed as a complete package, the “Innovation Field” Package contains a stand including fixtures, fittings, branding and a number of communication measures which are very valuable during a trade fair. These communication measures include, for example, the entry of the company in the official trade fair catalogue and the online exhibitor database, as well as use of an online press compartment on the productronica web site.

Plasma Parylene Systems GmbH is one of the exhibitors using the “Innovation Field” Package in the “Hybrid-component manufacturing” focus area. “This special offer enables us, as a smaller company on the market, to present our product portfolio to numerous and, especially, international trade visitors”, said Hans-Dieter Voss, CEO and proprietor of Firma Plasma Parylene Systems GmbH. The internationally operating company is involved in the development of new coating technologies in the field of polymers and in the construction of parylene and plasma systems.

The “Innovation Field” – package is also the ideal trade fair solution for Zimmermann and Schilp Handhabungstechnik GmbH: “As the world's leading trade fair, productronica provides a young company like us with a unique networking platform in which we can forge international business contacts. However, it is also important for us to exchange new ideas and trends in the industry“, said CEO Dr-Ing. Michael Schilp, whose company develops and produces systems and modules for non-contact transportation of sensitive objects from the semiconductor, solar and flat screen manufacturing industries. Further information about the “Innovation Field”-Package can be found on the productronica web site.

Located in the middle of the focus areas in Hall B3, the Innovation Forum will be one of the many platforms in which scientific and practical experts can exchange experiences and information on the latest trends in electronics production. New production technologies, applications and solutions will be vividly presented and discussed in the Innovation Forum, which is being organized by the German Engineering Federation (VDMA).

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