Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish

Circuit World

ISSN: 0305-6120

Article publication date: 15 May 2009

57

Citation

(2009), "Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish", Circuit World, Vol. 35 No. 2. https://doi.org/10.1108/cw.2009.21735bad.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2009, Emerald Group Publishing Limited


Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish

Enthone introduces OrmeSTAR™ Ultra Nanofinish®, organic metal-based PWB final finish

Article Type: New products From: Circuit World, Volume 35, Issue 2

Enthone, Inc. has introduced OrmeSTAR Ultra printed wiring board (PWB) final finish. The organic metal-based, Nanofinish® technology consumes approximately 90 per cent less energy and creates less waste versus elelectroless nickel/immersion gold (ENIG) and other traditional metallic final finishes. When compared to ENIG, OrmeSTAR Ultra reduces process time by 75 per cent. The finish costs 30 per cent less then ENIG, with no “black pad” risk. The versatile process delivers a high efficiency in application and operation throughout the entire supply chain.

OrmeSTAR Ultra provides a halogen-free coating that enables superior lead-free soldering with a surface conductivity comparable to pure gold. Signal transmission outperforms that of ENIG finishes. The nanofinish generates a visible coating that allows for ease of inspection and high first-pass yields with NO false failures at in-circuit test. Since there are no intermediate metals present, the solder bonds directly to copper to form the industry’s strongest solder joints.

OrmeSTAR Ultra bonds with copper without a displacement reaction, ensuring long-bath life, no microvoids, and no solder mask interface attack. The durable coating allows for wipe downs on misprinted assemblies with no copper oxidation. Hold (dwell) time between thermal cycles is similar to other metal finishes. Application during PWB fabrication can occur before electrical test. Low-application temperatures, minimal water usage and long-bath life make OrmeSTAR Ultra the most environmentally friendly hot air solder leveling alternative.

OrmeSTAR Ultra offers the reliability and easy application of an organic solderability preservative, with the durability and properties of a metal finish. For further information, please visit the web site: www.enthone.com or download the OrmeSTAR Ultra fact sheet at: www.enthone.com/docs/OrmeSTARUltraFactSheet.pdf

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