TY  - JOUR
AB  - 
VL  - 34
IS  - 2
SN  - 0305-6120
DO  - 10.1108/cw.2008.21734bab.006
UR  - https://doi.org/10.1108/cw.2008.21734bab.006
PY  - 2008
Y1  - 2008/01/01
TI  - US patent assigned to ViaForm® leveler copper damascene electroplating chemistry
T2  - Circuit World
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/16
ER  -