SMART Group at Nepcon Electronics 2007 - Helping Industry Competitiveness

Citation

(2007), "SMART Group at Nepcon Electronics 2007 - Helping Industry Competitiveness", Circuit World, Vol. 33 No. 2. https://doi.org/10.1108/cw.2007.21733bab.008

SMART Group at Nepcon Electronics 2007 - Helping Industry Competitiveness

SMART Group at Nepcon Electronics 2007 - Helping Industry Competitiveness

SMART Group will again be actively participating at the Nepcon Electronics Show to be held at the NEC Birmingham on 15-17 May.

The UK's leading Trade Association will provide a focus and meeting place for visitors at Booth L60. We will be offering a relaxed and informal place for engineers to obtain advice and guidance on all aspects of design, manufacturing, legislation and reliability issues facing industry today and for the future.

During the show SMART will be organising a series of presentations on topics to aid our industry success and competitiveness, plus a series of topical industry round table debates.

The SMART Group Round Table Debates are a new feature where key industry leaders will debate the main challenges facing industry. These daily events will provide the opportunity to have specific questions answered in this live interactive forum. Questions can be e-mail: technical@smartgroup.org

The topics featured at the Round Table Debates each day are:

Tuesday 15 May 12.30 p.m., Meeting Environmental Challenges, Chairman Sue Knight – Global Electronics.

Wednesday 16 12.30 p.m., Meeting Low Cost Manufacturing Challenges, Chairman Graham Naisbitt – Gen 3 Systems.

Thursday 17 12.30 p.m., Meeting Future Technology Challenges, Chairman Peter Grundy – PG Engineering.

The popular SMART Group Seminars will again be a feature at the show, the programme includes:

Tuesday 15 May

11.00 a.m. “A – Z of JTAG Testing and its Successful Introduction” Matt Lee – XJTAG.

1.30 p.m. “Component Obsolescence – Impact of RoHS on the Industry” Alan Baker – COG & Winslow Adaptics.

2.30 p.m. “Implication of Customer Data on Successful Sub Contract Assembly” Sue Knight – Laser Solutions.

3.30 p.m. “LEADOUT – Overview of the LEADOUT Reliability Projects” Simon Mason – LEADOUT Coordinator TWI.

Wednesday 16 May

11.00 a.m. “Choice of Base Material & Surface Finish for PCBs – Not a piece of cake” Lars Wallin – IPC European Representative.

1.30 p.m. “Conformal Coating – Achieving Long Term Reliability Improvements” Dr Chris Hunt – National Physical Laboratory.

2.30 p.m. “Advantage of Copper Filled Vias for HDI and Through Hole Circuits” Vin Makwana – Exception PCB.

3.30 p.m. “Land Grid Array (LGA) – Design and Manufacturing Success & Failure” Bob Willis – SMART Group.

Thursday 17 May

11.00 a.m. “Reducing PPM Defect Levels from the Printing Process” David Westwood & Peter Marshall – Teknek.

1.30 p.m. “What's Process Control Good For? Real Data from Real Manufacturing Sites” Pamela Lipson – Landrex Technologies.

2.30 p.m. “Making New Product Introduction (NPI) Successful” Peter Grundy – PG Engineering.

SMART Group Exhibitors Breakfast 9.00 a.m. on SMART Group Feature Area Stand L60 on Wednesday 16 May.

SMART Group will be hosting its Morning Breakfast prior to the exhibition opening on the Wednesday of the show. It's a great opportunity to meet fellow exhibitors, enjoy a bacon roll, coffee, orange juice, starting your day in the best way possible.

SMART Group is the largest trade association of its type in Europe running more seminars and workshops for electronics manufacturers than any other organisation. A visit to the SMART Group booth is an ideal opportunity to find out more about SMART, meet fellow engineers and to see how we help support the industry that supports us all.