Keywords
Citation
(2004), "Gould Positions TCR resistor foil for mainstream PCB market", Circuit World, Vol. 30 No. 4. https://doi.org/10.1108/cw.2004.21730dab.018
Publisher
:Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
Gould Positions TCR resistor foil for mainstream PCB market
Gould Positions TCR resistor foil for mainstream PCB market
Keywords: Printed-circuit boards, Resistors
Gould Electronics Inc. is positioning its TCR® resistor foil for the mainstream printed circuit board market by making it more affordable and widely available for manufacturers and laminators.
Improvements to TCR include an extension of the line for high Tg applications, production in 51 in. widths, expanded sales channels and revised pricing.
The product line extension is an enhanced resistor foil called TCR+(tm), which is specially designed to have improved bonding properties on phenolic-based and other specialty resin systems.
Previously manufactured in 39 in. widths, both TCR and TCR+ are now available in widths up to 51 in. Gould is the first with such a sputtered resistor foil offering and developed it specifically for laminators. The availability of wide web foil makes laminate with TCR foil more affordable for printed circuit board manufacturers.
Sales channels were expanded so printed circuit board manufacturers can purchase either TCR and TCR+ clad on laminate from their laminator of choice or unlaminated resistor foil directly from Gould. The products are available worldwide.
Pricing of the resistor foils has been improved, particularly for higher volume applications. Interested parties should contact their sales representative for specifics.
Like standard TCR, TCR+ is offered with a resistive material applied to the matte side of Doubletreat (DT) or JTCS shiny copper foil using roll-to-roll vacuum deposition technology.
The resistive material layer of TCR and TCR+ is uniform in composition and deposition thickness ensuring consistent results. Sheet resistance is isotropic and its variation within a roll and between rolls is less than ±5 percent for all resistance values. The resistive layer is a true thin film with thicknesses from 0.01 to 0.1 μm.
Gould developed TCR and TCR+ thin film resistor foils to meet the challenges of packaging high speed, high-density electronic devices. Integrating passive components into the circuit board using TCR foils can quickly and reliably improve electrical performance.
Gould will introduce TCR+ at the IPC Printed Circuits Expo, the industry's largest North American trade show, which starts 24 February and draws thousands of the key buyers and influencers for electronics assembly equipment, materials, supplies and software.
For further information, visit the Web site: www.gould.com