Keywords
Citation
(2004), "TIGER X-ray inspection system available with large OVIA", Circuit World, Vol. 30 No. 3. https://doi.org/10.1108/cw.2004.21730cad.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2004, Emerald Group Publishing Limited
TIGER X-ray inspection system available with large OVIA
TIGER X-ray inspection system available with large OVIA
Keywords: Inspection, X-ray
The TIGER X-ray inspection system from FEINFOCUS is now available with an extended Oblique View Inspection Area (OVIA) for 24 × 24 in. (610 mm × 610 mm) boards. The enlarged capabilities allow operators to inspect up to 24 × 20 in. (610 mm × 510 mm) at full oblique angles and highest magnification (Plate 1).
Plate 1
The TIGER X-ray inspection system
A large OVIA is critical in high-magnification X-ray inspection of large boards, as it enables even the edges of the board to be inspected with full tilt and rotate parameters. In addition, it allows users the freedom to view a set of smaller samples spread over the entire sample tray.
The TIGER is a unique 2D X-ray inspection system that offers a three-dimensional view via oblique viewing at virtually any desired angle utilizing the company's proprietary Auto Isocentric Motion (AIM) technology. The high- precision detector manipulator rotates a full 360°, and tilts up to 60° to view complex assemblies. The system also offers an additional two-axis (x and y) manipulation of the sample and a third axis (z) manipulation of the X-ray tube, with positional accuracy down to 100 μm. FEINFOCUS proprietary open tube X-ray technology allows for feature recognition below 1 μm.
Designed to meet the rigorous needs of computer, automotive, telecom, military/ aerospace, medical device, and information storage markets, the TIGER system offers a geometric magnification of up to 636 × (total magnification up to 2,800×), FEINFOCUS' proprietary True X-ray Intensity (TXI) control for consistent image quality, and an extra-large sample tray area of up to 24 in. × 24 in. (610 × 610 mm) to accommodate larger boards and multi-up flip chip assemblies.