Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2003




(2003), "IPC", Circuit World, Vol. 29 No. 4. https://doi.org/10.1108/cw.2003.21729dab.001



Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited



Keywords: IPC, APEX

Call for participation issued for IPC Printed Circuits Expo/APEX

IPC – Association Connecting Electronics Industries® announces a call for participation in its IPC SMEMA Council's APEX® and IPC Printed Circuits Expo® combined technical conference and professional development program, which will take place on 23-27 February 2004, at the Anaheim Convention Center in Anaheim, Calif.

Recently, IPC released its plan to co-locate the two exhibitions in 2004 in order to tighten the links of the supply chain. Through the restructured event, IPC will be able to better serve both the printed circuit board (PCB) and electronics manufacturing industries.

To participate in the industry's premier conference on electronics manufacturing, a 300-word abstract that summarizes original and previously unpublished work and covers case histories, research and discoveries must be received by June 20, 2003.

Papers are being sought on design, materials, assembly, processes and equipment in the following areas:

  •  Design

  •  PCB fabrication

  • Soldering (including lead free)

  • Electromigration and tin whiskers

  • Flexible circuitry

  •  Packaging and components

  •  Area Array – flip chip – 0201

  •  Embedded passive and active devices

  •  Via plugging and other protection

  •  HDI technologies

  •  Surface finishes

  •  Black pad

  •  Factory automation

  •  Environmental concerns

  •  Electronic manufacturing services

  •  Business and supply chain issues

  •  Test, inspection and AOI

  •  Performance, quality and reliability

  •  Optoelectronics

For further details visit our Web site at www.goapex.org

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