NanoVia develops hyper speed microvia drilling process

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2003

52

Citation

(2003), "NanoVia develops hyper speed microvia drilling process", Circuit World, Vol. 29 No. 1. https://doi.org/10.1108/cw.2003.21729aad.003

Publisher

:

Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


NanoVia develops hyper speed microvia drilling process

NanoVia develops hyper speed microvia drilling process

NanoVia, LP has introduced HyperVia&#153 holographic microvia drilling technology for drilling current and next generation high-density 3G smart chip carrier packages. The HyperVia&#153 microvia drilling technology can produce microvias on randomly pitched grid arrays at process rates exceeding 100 per cent faster than current laser systems on the market; this through put rate is anticipated to triple within the next 10 months, once a new laser technology arrives from one of its strategic laser vendors.

The new HyperVia&#153 technology is the second iteration of an optical system licensed to Hitachi Via Mechanics, Japan, in a 4 year exclusive license. NanoVia has already delivered several optical sub-systems to Hitachi and will begin to ship modules as the technology enters the US and Asian markets.

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