NanoVia, LP strengthens its Microvia Patent Portfolio

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2003

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Keywords

Citation

(2003), "NanoVia, LP strengthens its Microvia Patent Portfolio", Circuit World, Vol. 29 No. 1. https://doi.org/10.1108/cw.2003.21729aab.020

Publisher

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Emerald Group Publishing Limited

Copyright © 2003, MCB UP Limited


NanoVia, LP strengthens its Microvia Patent Portfolio

NanoVia, LP strengthens its Microvia Patent Portfolio

Keyword: NanoVia

NanoVia, LP has announced the receipt of Notice of Allowance for a US patent, entitled Control System and Apparatus for Ablating High-Density Array of Vias or Indentation in Surface of Object. The invention patented, combines the optics and precision of laser imaging with a wide range of hybrid holographic and diffractive optical elements, allowing a manufacturer to access new levels of throughput and substantial reductions of process costs, otherwise unattainable using today's technology. The optical module and control system is flexible to facilitate quick and simple or complex grid array package configurations, and small enough to integrate into most existing laser microvia systems. In addition, the optical and control system provides unprecedented drilling speeds, which is critical for future high-density grid array packages use for processor and memory chips.

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