Keywords
Citation
(2001), "HDI solutions fact sheet published by Polyclad Technologies", Circuit World, Vol. 27 No. 3. https://doi.org/10.1108/cw.2001.21727cab.021
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
HDI solutions fact sheet published by Polyclad Technologies
HDI solutions fact sheet published by Polyclad Technologies
Keywords: Polyclad, Publication
Polyclad Technologies has published an HDI Solutions fact sheet. The fact sheet provides a full listing with descriptions of Polyclad® laminates, prepregs, resin coated foils and Enthone® liquid dielectric materials specifically developed for fabricating high density interconnect (HDI) microvias.
Offering the most complete set of products and processes in the industry, Polyclad Technologies is the only PWB supplier that provides all the major technology options to build microvias using reinforced, non-reinforced and liquid dielectric materials. Backed by comprehensive technical support, each option is fully integrated to meet specific end-use applications.
Copies of the fact sheet may be requested from: hdi-solutions@polyclad.com