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IPC. Technical standards forums open to all attendees at IPC Printed Circuits Expo 2001
Technical standards forums open to all attendees at IPC Printed Circuits Expo 2001
Keywords: IPC, Standards, Exhibitions
IPC will introduce the Technical Standards Forums at IPC Printed Circuits Expo 2001. This new format, hosted by the IPC Technical Standards Committees, will take place on Monday, 2 April 2001, and has been created to reduce conflicts with the technical conference and allow committee members to spend more time on the trade show floor.
Attendees can now visit each of the committees in individual sessions and receive updates on subcommittee and task group efforts.
"These new forums give everyone the opportunity to get caught up on standards activities and share their experiences with committee leaders and peers", said IPC director of PCB Standards and Technology, Chris Jorgensen.
"This is a great chance for new attendees to be introduced to committee activities and industry leadership", said Michael Hill, Viasystems, and Technical Activities Executive Committee (TAEC) chair.
The committees holding forums include:
Data Generation and Transfer Committee.
Printed Board Base Materials Committee.
Fabrication Processes Committee.
Environmental Health and Safety (EHS) Committee.
Testing Committee and Process Control Management Committee.
Flexible Circuits Committee.
High Speed/High Frequency Committee.
Rigid Printed Board Committee.
High Density Interconnect Committee.
Full committee handouts and advanced agendas for the forums will be posted on the IPC Printed Circuits Expo Web site at www.ipcprintedcircuitexpo.org