Excellon Automation and PhotoMachining inc. announces technology sharing agreement in laser micro machining

Circuit World

ISSN: 0305-6120

Article publication date: 1 December 2000

48

Keywords

Citation

(2000), "Excellon Automation and PhotoMachining inc. announces technology sharing agreement in laser micro machining", Circuit World, Vol. 26 No. 4. https://doi.org/10.1108/cw.2000.21726dab.013

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Excellon Automation and PhotoMachining inc. announces technology sharing agreement in laser micro machining

Excellon Automation and PhotoMachining inc. announces technology sharing agreement in laser micro machining

Keywords Excellon, Photomachining

Excellon Automation Co., and PhotoMachining Inc., have established a cooperative technology-sharing agreement in the field of laser micro machining. Rick Tippett (president, Excellon Automation) and Ronald Schaeffer (CEO, PhotoMachining) announced a working agreement designed to build upon each company's strengths in the Laser Micro Machining arena. While the terms of the agreement are not disclosed, PhotoMachining will take delivery of a LVD 2001 Diode Pumped Dual Laser (IR and UV) system.

According to Ron Schaeffer, "the market research PhotoMachining has conducted indicated that such a dual laser micro-machining system would allow them to capture market share in this emerging microelectronics marketplace". According to Rick Tippet, "the technology-sharing agreement with PhotoMachining will allow Excellon to further develop the LVD 2001 DP laser micro via drilling system into an even more versatile tool for our customers." Mr Tippett went on to say, "The Excellon collaboration with PhotoMachining will quickly provide new application opportunities for our customers to maximize their investment in our equipment." As Excellon focuses its efforts on the North American marketplace, this collaborative effort can quickly bring competitive advantages to our customers through shared R&D.

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