Innovation MID. Call for papers

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000

Citation

(2000), "Innovation MID. Call for papers", Circuit World, Vol. 26 No. 2. https://doi.org/10.1108/cw.2000.21726bac.002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Innovation MID. Call for papers

Call for papers

MID: Breakthrough to the market

Since the last conference two years ago, the acceptance and market penetration of MID has been increased in several fields of industries. New applications and innovative production processes lead to remarkable milestones in the MID technology

Based on the previous successful conferences in Erlangen, the 4th International Congress, "Molded Interconnect Devices", offers an outstanding platform for the exchange of experiences for MID-developers, researchers and potential users. One of the focuses in this conference will be on the presentation of highly innovarive products from various industries. Nevertheless, distribution of general knowledge about the technology is still an important issue. In addition, posters, equipment and services in the field of MID will be presented in a parallel exhibition.

Experts of industry and research are invited to present a paper on the topics listed besides.

Submissions of abstracts and papers

Papers are invited on the topics listed beside or others within the general theme of the conference. Abstracts of no more than 300 words in one page of A4 sheet (text and graphics possible) should be sub-mitted in English to the conference secretariat. Abstracts should contain the following information:

  • title of paper;

  • subject/topic of the paper;

  • name, affiliation and address of author(s).

Abstracts will be refereed before acceptance by the program committee. Complete papers should be no more than six pages of A4 size. An author's kit will be sent separately. It is essential that the author should present the paper at the conference. Speakers may attend the conference free of charge. The proceedings of MID 2000 will additionally be published after the conference.

Important dates

  • Submission of abstracts: 15 March 2000.

  • Notification of acceptance: 15 April 2000.

  • Submission of full text of the papers: 15 July 2000.

  • MID 2000 Conference: 27-28 September 2000.

Topics for papers

Papers are invited particularly in the following areas:

  1. 1.

    MID applications:

    • New product concepts and designs.

    • Economical aspects.

    • Technical features.

    • Benefits from freedom of design.

  2. 2.

    MID to the Market:

    • Strategies to enter new markets.

    • Learning by initial projects.

    • Criteria for process selection.

  3. 3.

    Manufacturing of MIDs:

    • Polymer processing.

    • Metallization of plastics.

    • Structuring of circuitry.

  4. 4.

    Advanced materials:

    • Thermoplastics.

    • Auxiliary.

    • Materials platability.

  5. 5.

    3-D assembly:

    • SMD, Chip on MID, THD.

    • Soldering technologies.

    • Alternative connection techniques.

  6. 6.

    Integrated CAD/CAM systems:

    • Integration of ECAD and MCAD.

    • 3-D MID-layout, design and simulation.

  7. 7.

    Quality Assurance.

  8. 8.

    Recycling:

    • Disassembly of MID-applications.

    • Separation of plastics and metals.

    • Properties of recycled materials.

  9. 9.

    Future trends.