Enthone-OMI opens high volume copper manufacturing facility

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000




(2000), "Enthone-OMI opens high volume copper manufacturing facility", Circuit World, Vol. 26 No. 2. https://doi.org/10.1108/cw.2000.21726bab.035



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Enthone-OMI opens high volume copper manufacturing facility

Keywords Enthone-OMI, Seniconductors, Electrodeposition

Enthone-OMI Inc. recently completed the construction of a high volume manufacturing facility for its semiconductor grade, high purity copper electrodeposition processes.

Located at 350 Frontage Road, West Haven, CT, the 1,000 square foot facility represents a $750,000 investment that meets the demanding manufacturing requirements of semiconductor manufacturers worldwide. The facility exceeds Class 1000 packaging and features computer integrated manufacturing, including on-line particle count. Coupled with fully automated, enclosed chemical distribution and dedicated processing streams, the new facility ensures stringent batch-to-batch control and consistency.

Enthone-OMI's commitment to the semiconductor industry is further evidenced by the wafer scale application development laboratory opened in 1997. The lab allows the company to evaluate copper interconnect, flip chip and bump plating requirements in a tool scale environment. In the last two years over $1.5 million in new manufacturing and technical resources have been dedicated to supporting the semiconductor industry.

Related articles