Education certificate available at IPC printed circuits expo

Circuit World

ISSN: 0305-6120

Article publication date: 1 June 2000




(2000), "Education certificate available at IPC printed circuits expo", Circuit World, Vol. 26 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Education certificate available at IPC printed circuits expo

Education certificate available at IPC printed circuits expo

Keywords IPC, Printed circuit boards, Certification, Training

For the first time, certification for JEPC-A-600, Acceptability of Printed Boards, is available at IPC Printed Circuits ExpoSM. The worker proficiency certification course is one of 24 tutorials being offered at Expo, taking place 2-6 April 2000, at the San Diego Convention Center.

To date there have been more than 150 instructors certified through the IPC-A-600 training program; hundreds more have been trained as operators. Released a little more than a year ago, tiffs is the first opportunity IPC has had to provide operator-level certification at Expo. "It's the only program for PWB manufacturers that provides a professional credential. It is an invaluable tool for those inspecting printed boards on the customer or supplier end", says IPC vice president of professional development, John Riley.

The course curriculum is based on the IPC-A-600 standards, and covers "target", "acceptable", and "nonconforming" criteria for base material, plated and unsupported holes, conductive patterns and features, markings and solder resist conditions. Those who test successfully will receive a certificate of proficiency good for two years.

The IPC-A-600 course is a two-day course beginning 2 April. Testing will take place on 6 April. Other tutorials being offered at Expo include:

  • Pitfalls and roadblocks to the implementation of Microvia technology - This course will highlight those processes necessary to successfully produce microvia boards. The major focus will be on wet processes and possible roadblocks to acceptable quality levels.

  • Substrate selection criteria for HDI assemblies. Many factors are weighed when considering base materials for high density applications, including thickness, weight per square inch and thermal stability. This tutorial explores differences in these factors and offers guidance in choosing the optimum material for a given application.

  • Process control in printed circuit fabrication. This tutorial covers process control planning, process analysis, control and improvement tools, identification of process control parameters and implementation of process control methods.

  • Microvia and HDI: material selection, fabrication processes, and design guidelines. Design guidelines for three high density interconnect techniques: laser, photo-defined, and plasma etching.

For a complete schedule of tutorials visit the IPC Printed Circuits Expo Web site at Registration can be completed at the Web site, or by calling (847) 790-5361.

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