Du Pont announces joint venture expansion

Circuit World

ISSN: 0305-6120

Article publication date: 1 March 2000

Keywords

Citation

(2000), "Du Pont announces joint venture expansion", Circuit World, Vol. 26 No. 1. https://doi.org/10.1108/cw.2000.21726aab.004

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Du Pont announces joint venture expansion

Du Pont announces joint venture expansion

Keywords Du Pont, Teijin

Teijin Limited and Du Pont have announced an expansion of their existing joint venture in aramid papers to include specialty papers used for electronic circuit substrates. The existing joint venture has been successful in the development, manufacture and marketing of aramid papers for electrical insulation in industrial equipment since its formation in 1994. This same joint venture will now become a center for development and production of specialty papers that are being adopted in smaller, lighter designs of mobile phones and other consumer electronics.

Aramid substrates are increasingly attractive alternatives to glass and resin-coated foils in consumer and industrial electronics applications demanding greater circuit density and system reliability.

Teijin and Du Pont will work together to produce high quality papers based on aramid materials. The joint venture will market aramid papers directly in Japan; through Du Pont Teijin Advanced Papers (Asia) Ltd, an existing Hong Kong JV between DuPont and Teijin, for Asian countries outside of Japan; and through the Du Pont Advanced Fibers Systems business unit in other parts of the world.