Keywords
Citation
(2000), "Horizontal plater launched", Anti-Corrosion Methods and Materials, Vol. 47 No. 2. https://doi.org/10.1108/acmm.2000.12847bab.011
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Horizontal plater launched
Horizontal plater launched
Keywords: PAL, R&D, Plating
PAL - Process Automation International Ltd (Tel: +44 (0) 181 940 2070) - has a long standing reputation for its commitment to R&D. The fruits of those R&D labours were obvious to all last Autumn when, at the Productronica exhibition, PAL unveiled its latest development.
The company reports that nearly three years intensive and comprehensive R&D has been invested in its latest introduction - horizontal panel plating modules, designed to meet current manufacturing requirements in the PCB manufacturing world. "ISO14000 regulations and increased circuit complexity have forced manufacturers to seek ever more environmentally friendly and more advanced automation for their production processes. In order to serve this trend they joined forces with another PAL Group company, IML of Taiwan (experts in horizontal conveyorized systems) and Shipley Ronal (experts in plating chemicals) to develop a new generation of horizontal copper panel plating modules," explains Geoff Paterson, PAL's Managing Director.
PAL informs us that there is a planned programme of continuous improvement for the new horizontal plater with the development programme incorporating the application of new technologies including Pulse Plating, Blind Vias and Microvia plating.