Horizontal plater launched

Anti-Corrosion Methods and Materials

ISSN: 0003-5599

Article publication date: 1 April 2000




(2000), "Horizontal plater launched", Anti-Corrosion Methods and Materials, Vol. 47 No. 2. https://doi.org/10.1108/acmm.2000.12847bab.011



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Horizontal plater launched

Horizontal plater launched

Keywords: PAL, R&D, Plating

PAL - Process Automation International Ltd (Tel: +44 (0) 181 940 2070) - has a long standing reputation for its commitment to R&D. The fruits of those R&D labours were obvious to all last Autumn when, at the Productronica exhibition, PAL unveiled its latest development.

The company reports that nearly three years intensive and comprehensive R&D has been invested in its latest introduction - horizontal panel plating modules, designed to meet current manufacturing requirements in the PCB manufacturing world. "ISO14000 regulations and increased circuit complexity have forced manufacturers to seek ever more environmentally friendly and more advanced automation for their production processes. In order to serve this trend they joined forces with another PAL Group company, IML of Taiwan (experts in horizontal conveyorized systems) and Shipley Ronal (experts in plating chemicals) to develop a new generation of horizontal copper panel plating modules," explains Geoff Paterson, PAL's Managing Director.

PAL informs us that there is a planned programme of continuous improvement for the new horizontal plater with the development programme incorporating the application of new technologies including Pulse Plating, Blind Vias and Microvia plating.

Related articles