Patents

Assembly Automation

ISSN: 0144-5154

Article publication date: 5 April 2013

487

Citation

(2013), "Patents", Assembly Automation, Vol. 33 No. 2. https://doi.org/10.1108/aa.2013.03333baa.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 2013, Emerald Group Publishing Limited


Patents

Article Type: Patent abstracts From: Assembly Automation, Volume 33, Issue 2

Title: Self-assembly controllable preparation method of composite of metal nano particles and carbon materialsApplicant(s): UNIV SOOCHOW±Publication number: CN102554244 (A)Publication date: 11 July 2012

Abstract: The invention discloses a self-assembly controllable preparation method of a composite of metal nano particles and carbon materials. The self-assembly controllable preparation method comprises the steps that carbon material nano carriers are first and fully scattered into an ionic liquid solution through ultrasound, and turbid liquid of the carbon material carriers and the ionic liquid is obtained; then the turbid liquid is transferred into a container, various different metal targets are sputtered into the turbid liquid through using a magnetic control sputtering method, and a mixed solution of the ionic liquid, the carbon materials and the metal nano particles is obtained for the time being; and finally, the ionic liquid is washed clean through adopting a high speed centrifugation method and utilizing an organic solvent of acetone, absolute ethyl alcohol or the like, and the nano composite of the metal nano particles and the carbon material carriers formed through self-assembly can be obtained. By using the self-assembly controllable preparation method, various high-quality composites formed by the metal nano particles and the carbon materials can be prepared through a self-assembly process, the size of the metal nano particles can be controlled through selecting different ionic liquid, and the density of the metal nano particles can be controlled through changing a sputtering condition (see the last paragraph of texts and the last picture). The controllability of the self-assembly controllable preparation method is good, extra reducing agents does not need to be added, and no by-product is produced.

Title: Arbitrary assembly of nano-objects into designed 1D AND 2D arraysApplicant(s): Brookhaven Science Ass. LLC [US]; Gang Oleg [US]; Van Der Lelie Daniel [US]Publication number: WO2011112512 (A1)Publication date: 15 September 2011

Abstract: The present invention is directed to nanoscale fabrication of nano-materials with application in electronics, energy conversion, bio-sensing and others. Specifically, the invention is directed to arbitrary, that is periodic and non-periodic, assembly of nano-objects on I D and 2D arrays. The present invention utilizes self-organization properties of nanoscale bio-encoded building blocks, programmability of biomolecular interactions, and simple processing techniques for providing arbitrary by-design fabrication capability. Specifically, the present invention utilizes double stranded DNA attached to a surface and intercalating PNA-DNA hybrids attached to nano-objects to bind the nano-objects to the dsDNA in a site specific manner. The present invention allows for an integration of a large number of nano-components in unified well-defined systems. Accordingly, the present invention is applicable for fabrication of I D and 2D structures of various by-design placements of nano-objects of multiple types, including metal, semiconducting and organic nano-objects.

Title: Method for self-assembling micro-electromechanical system (MEMS) based on solder ball laser remelting processApplicant(s): Harbin Inst. of TechnologyPublication number: CN102489810 (A)Publication date: 13 June 2012

Abstract: The invention discloses a method for self-assembling a micro-electromechanical system (MEMS) based on a solder ball laser remelting process, and relates to a method for self-assembling the MEMS. The invention aims to solve the problems that: according to the conventional method for self-assembling the MEMS based on the surface tension of molten solders, a process for integrating solder alloys is complicated, the integral heating and remelting of an MEMS device are not applicable to optical MEMS devices which are sensitive to heat and force, and a multiple self-assembly process with a logical sequence which is realized by the local heating of a resistor is complicated and cannot response complicated structures. Scheme 1 is that: a solder ball released on a metal bonding pad of an MEMS chip is heated by laser so as to ensure that the solder ball is molten and pulls a movable structure of the MEMS chip to realize tilting motion. Scheme 2 is that: solder alloy balls are released on a plurality of bonding pad connection centers and are heated and remolten, so that the self-assembly of a first rotating mechanism, a second rotating mechanism and a third rotating mechanism is sequentially finished. The method is used for micromachining manufacturing technologies.

Title: MEMS device assembly and method of packaging sameApplicant(s): Freescale Semiconductor Inc. [US]±Publication number: US2012175747 (A1)Publication date: 12 August 2012

Abstract: An assembly includes a MEMS die and an integrated circuit die attached to a substrate. The MEMS die includes a MEMS device formed on a substrate. A packaging process entails forming the MEMS device on the substrate and removing a material portion of the substrate surrounding the device to form a cantilevered substrate platform suspended above the substrate at which the MEMS device resides. The MEMS die is electrically interconnected with the IC die. A plug element can be positioned overlying the platform. Molding compound is applied to encapsulate the die, the IC die, and substrate. Following encapsulation, the plug element can be removed, and a cap can be coupled to the substrate overlying an active region of the MEMS device.

Title: Manual-operated micromanipulation gripping tool with exchangeable compliant gripperApplicant(s): Chang Ren-Jung [TW]Publication number: TW201111115 (A)Publication date: 1 April 2011

Abstract: This invention is a manual-operated compliant micro-gripping tool. It includes gripping unit, holding unit, and manipulating unit. Gripping unit consists of gripper, which is a one piece compliant mechanism including gripper, connection linkages, and compliant joints, and extension assembly tube. The gripping unit, holding unit, and manipulating unit are assembled together. By controlling the pushing of manipulating unit, the connection linkages are driven to cause the opening of gripper. By the pulling of manipulating unit to cause the separation between driving linkage and gripper, the elastic potential energy stored during opening will be released and the gripper is closing for grasping operation.; This invention can be applied to different applications by changing different gripping units for providing proper gripping force in the grasping, holding, and transporting different objects from ten to hundred of micrometers.

Title: Monolithic fabrication of 3D structuresApplicant(s): Harvard College [US]; Sreetharan Pratheev [US]; Whitney John [US]; Wood Robert [US]Publication number: WO2012109559 (A1)Publication date: 16 August 2012

Abstract: A multi-layer, super-planar structure can be formed from distinctly patterned layers. The layers in the structure can include at least one rigid layer and at least one flexible layer; the rigid layer includes a plurality of rigid segments, and the flexible layer can extend between the rigid segments to serve as a joint. The layers are then stacked and bonded at selected locations to form a laminate structure with inter-layer bonds, and the laminate structure is flexed at the flexible layer between rigid segments to produce an expanded 3D structure, wherein the layers are joined at the selected bonding locations and separated at other locations.

Related articles