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Emerald Group Publishing Limited
Copyright © 2011, Emerald Group Publishing Limited
Fast-cure, low-shrink adhesive for optic assembly eliminates parts movement
Article Type: New products From: Assembly Automation, Volume 31, Issue 3
New from Intertronics is a fast-cure, low-shrink adhesive for optic assembly (Figure 2) which eliminates parts movement – DYMAX OP-67-LS opto-mechanical adhesive cures in seconds for bonding of optical components, whilst its low-shrink nature virtually eliminates movement during curing and subsequent thermal cycling. OP-67-LS offers the ability to “cure on demand” with exposure to long wave UV and visible light, allowing maximum flexibility in positioning parts prior to cure. OP-67-LS features 0.2 per cent linear shrinkage upon cure.
OP-67-LS offers superior moisture resistance, very low outgassing and adhesion to a variety of substrates including metal, glass, ceramic and polycarbonate, allowing its use in many critical and demanding applications such as fibre-optic “V” groove bonding, positioning laser diodes, fibre pig tailing, transceiver potting, VCSEL positioning and mounting active devices, or passive couplers, prisms and other optical device assemblies.
Further information regarding Intertronics’ products can be found available at: www.intertronics.co.uk