Patent Abstracts

Citation

(2006), "Patent Abstracts", Assembly Automation, Vol. 26 No. 4. https://doi.org/10.1108/aa.2006.03326dad.006

Patent Abstracts

Keywords: Electronics industry, Patents

Title: A machine vision inspection system and methodApplicant: MV RES LTD (IE)Patent number: GB2417072Publication date: 15 February 2006

For an electronics circuit production line 1 there is a series of nodes 2-5 each located after a particular production stage 10-13. Each node performs a line scan of the full circuit. It then extracts component images and saves them to local storage indexed on circuit identifier. A controller six polls the nodes to retrieve a series of images for a particular component of a circuit if a defect is detected during downstream testing. This series of images gives a defect creation history for quick identification of the source of a defect.

Title: An assembly comprising functional devices and method of making sameApplicant: Alien Technologies INC (US); Craig Gordon S W (US); Tootoonchi Aly (US); Eisenhardt Randy (US); Herrmann Scott (US); Hadley Mark A (US); Drzaic Paul (US)Patent number: WO2006052955Publication date: 18 May 2006

Methods and apparatuses for an electronic assembly. A material is selectively printed on a web substrate at one or more selected areas. The web substrate includes a plurality of functional components having integrated circuits. A local printing system equipped with a print head that dispenses the selected material is used to print. The print head is coupled to a guidance system capable of registering an alignment feature on the web substrate.

Title: Manufacturing method of piezoelectric oscillator and sheet type substrate thereofApplicant: KYOCERA KINSEKI CORPPatent number: JP2006019999Publication date: 19/01/2006

Problem to be solved: to provide a piezoelectric oscillator capable of increasing productivity by simplifying an assembly process.

Solution: formation is performed to a sheet type substrate mutually connected at the side of a vessel having a number of recessed openings. A piezoelectric vibrator is mounted to the vessel having respective recessed openings. The vessel having the recessed openings is airtightly sealed by a lid body placed at the recessed opening. A number of piezoelectric oscillators A are provided, where a plurality of chip type electronic components are placed and include at least one integrated circuit making continuity with the piezoelectric vibrator placed on a vessel bottom surface in a direction opposite to the recessed opening of each vessel via a substrate.

Title: Universal connector assembly and method of manufacturingApplicant: Pulse Eng Inc (US); Machado Russell L (US); Renteria Victor (US); Dinh Thuyen (US)Patent number: WO2006004993Publication date: 12 January 2006

An advanced modular plug connector assembly incorporating an insert assembly disposed in the rear portion of the connector housing. In one embodiment, the connector has a plurality of ports in multi-row configuration, and the insert assembly includes a substrate adapted to receive one or more electronic components such as choke coils, transformers, or other signal conditioning elements or magnetics. The substrate also interfaces with the conductors of two modular ports of the connector, and is removable from the housing such that an insert assembly of a different electronics or terminal configuration can be substituted, therefore. In this fashion, the connector can be configured to a plurality of different standards (e.g. Gigabit Ethernet and 10/ 100). In yet another embodiment, the connector assembly comprises a plurality of light sources (e.g. LEDs) received within the housing. Methods for manufacturing the aforementioned embodiments are also disclosed.

Title: Modular electronic assembly and method of makingApplicant: AVX Corp. (US)Patent number: WO2005008733Publication date: 27 January 2005

A modular electronic assembly and a method for making a modular electronic assembly are disclosed. The subject modular electronic assembly is constructed in such a way as to maximize available surface area on printed wiring boards by incorporating pretested discrete passive elements within the body of such printed wiring boards and electrically connecting the elements in a volume-efficient manner. A modular electronic assembly constructed according to the presently disclosed subject matter is formed by arranging a plurality of diverse, pretested passive components between a plurality of copper and tacky epoxy sheets, holding the passive components in place by an epoxy resin layer and electrically connecting the components together by electrical vias penetrating the tacky epoxy layers. A modular electronic assembly according to the disclosed technology provides maximum available “real estate” for mounting active and other components on the surface of printed wiring boards while significantly reducing the amount of lead (Pb) used to form similar known printed wiring boards.

Title: Sensor assembly and methods of making and using sameApplicant: Nerenberg Michael (US); Richey James S (US); Nebrigic Dragan (US); Lee Jason (US); Leclair Tim (US); Bellew Colby (US); Collins Boyce E (US); Liu Kelvin (US)Patent number: WO2004082363Publication date: 30 September 2004

A sensor assembly for sensors such as microfabricated resonant sensors is disclosed. The disclosed assembly provides improved performance of the sensors by providing a thermally insensitive environment and short pathways for signals to travel to processing components. Further, the assembly provide modular construction for the sensors and housing modules, thereby allowing replacement of the sensors at a lower cost. The assembly includes a sensor module including a sensor formed on a conductive substrate with a cavity formed on one surface. The substrate has conductive vias extending from the cavity to a second surface of the substrate. A housing assembly accommodates the sensor and includes a rigid housing, preferably made from a ceramic. An electronic component, such as an amplifier, is mounted on the rigid housing. The electronic component electrically engages the vias substantially at the second surface of the substrate. The electronic component receive signals from the sensor through the vias. The signals are then processed through an amplifier and a digital signal processor using a modified periodogram.