New compact surface mounters combine speed and accuracy for cost-performance benefits

Citation

(2005), "New compact surface mounters combine speed and accuracy for cost-performance benefits", Assembly Automation, Vol. 25 No. 4. https://doi.org/10.1108/aa.2005.03325dad.006

New compact surface mounters combine speed and accuracy for cost-performance benefits

New compact surface mounters combine speed and accuracy for cost-performance benefits

Keywords: Assembly, Printed circuits

Sony Manufacturing Systems Europe has extended its successful range of cellular electronic production equipment with the announcement of two new surface mounters that provide a market-leading combination of speed, placement accuracy, and small footprint (Plate 6).

Plate 6 New compact surface mounters combine speed and accuracy for cost-performance benefits

The SI-F130 high-speed mounter and SI-F209 flexible high-precision mounter are both equipped with high- speed on the fly parts recognition, and a newly-developed image processing system that automatically generates image data for complex new parts. Their compact “cellular” design builds on Sony's approach of providing smaller mounters to make more productive use of factory floor space, to create production lines that are flexible and expandable and thus improve cost- performance figures.

Featuring an advanced 12-nozzle rotary “planet” head that can move freely in two dimensions and an overlapping process to pre-load components, the SI-F130 achieves tact times as low as 0.139s, equivalent to a mounting speed of 25,900 components/ hour. The device also features a newly- developed ejector system that reduces PCB load/unload time to zero, further cutting cycle times and contributing to an overall performance improvement of 40 per cent over previous-generation machines. The SI-F130 is only 120 cm wide and less than 145 cm deep, and is designed so that multiple machines can be connected in-line to meet production and throughput demands. Cassette loading is from both front and rear, and mounting accuracy is ±0.06 mm.

The SI-F209 fine-pitch model features a pick-up inspection function and parts recognition allowing it to place even small-sized and irregular shaped parts at an accuracy of ±0.04 mm. Its mounting tact time of 0.49 s equates to a mounting speed of 7,350 components/hour, achieved with the aid of automated pickup position correction, flying vision and flying nozzle change functions. Using a six-nozzle head, the device is controlled via an easy-to-use. Windows-based interface. Sony's new ejector system cuts loading/unloading time to just 0.6 s.

“Sony's cellular mounter concept focuses on value for money, not simply volume”, said Yoshiki Fujii, Managing Director, Sony Manfacturing Systems Europe. “We optimise our offering on price-per- shot, reducing the space required on the production floor and maximising flexibility”, he continued.

To further facilitate its customers' advanced manufacturing operations, Sony Manufacturing Systems collaborates with Sony's Financial Services division to provide a range of payment and finance options. These give customers access to the latest technology, whilst managing capital expenses.

Sony Manufacturing Systems has worked closely with its software partner, Sony TiMMS, to provide an integrated hardware/software solution that manages data and processes from PCB design to final production. The TiMMS system provides links between procurement, design, manufacturing and test, improving inventory management and ensuring that essential data is shared throughout the enterprise.