Precision laser machining

Citation

Rigelsford, J. (2004), "Precision laser machining", Assembly Automation, Vol. 24 No. 1. https://doi.org/10.1108/aa.2004.03324aad.010

Precision laser machining

Precision laser machining

Keywords: Patents, Lasers

Applicant: Seiko Epson Corporation, JapanPatent number: US6,635,850Publication date: 21 October 2003Title: Laser machining method for precision machining

This patent presents a laser machining apparatus that can provide high precision machining of fine patterns and that is suitable for use in mass production. The invention also relates to a high quality liquid crystal display panel having an electrode structure that is patterned by this laser machining method.

The apparatus comprises a plurality of pulse laser generators, drivers for alternately driving a plurality of pulse laser generators to generate laser beams delayed in phase between each other; collimators for making the generated laser beams equal in quality; a wave plate for converting the laser beams into elliptically polarized laser beams; and a phase grating for dividing each laser beam emitted by each of the plurality of laser beam generators into a plurality of laser beams; such that an object to be processed is selectively illuminated with the plurality of laser beams produced by phase grating. The phase grating has structure on its surface for dividing each of the laser beams into equal intensity beams. This enables tiny grooves to be uniformly formed in a liquid crystal display area at constant intervals, providing a much greater contrast ratio and much better visibility performance of the display.