Wickmann leaded fuses go pip

Citation

(2003), "Wickmann leaded fuses go pip", Assembly Automation, Vol. 23 No. 4. https://doi.org/10.1108/aa.2003.03323daf.004

Wickmann leaded fuses go pip

Wickmann leaded fuses go pip

Keywords: Assembly, Printed circuit boards

Leaded electronic components are being increasingly used on surface-mount printed circuit boards by using the technique known variously as pin in paste (PIP), pin in hole or through-hole reflow processing. This enables circuit designers to select components with specifications that are not currently available in SM form (Plate 4).

Since populating boards using the PIP technique requires only a single assembly line and the need for wave soldering is eliminated, this leads to significant cost savings. However, only leaded components that are capable of withstanding exposure to the high reflow soldering temperatures can qualify for selection.

Plate 4 Wickmann TR5 leaded fuses being placed on a surface-mount board

Components which have recently been qualified for use with the PIP technique are Wickmann's subminiature TR5, TE5 fuses and 5 × 20 mm fuse clips. Soldering heat resistance of all fuses and holders in these series is 260 C, 10 s, making them ideal for reflow soldering. Fuses in the TR5 series have rated voltages up to 250 V and rated currents up to 6.3 A while the rated voltages of the TE5 fuses are up to 125 V and currents up to 6.3 A. They are supplied in blister tape reeled for use with most types of pick and place equipment.

A free sample kit, together with a detailed PIP application note, is available from Wickmann Components.