TY  - JOUR
AB  - 
VL  - 23
IS  - 4
SN  - 0144-5154
DO  - 10.1108/aa.2003.03323dae.001
UR  - https://doi.org/10.1108/aa.2003.03323dae.001
AU  - Rigelsford Jon
PY  - 2003
Y1  - 2003/01/01
TI  - Practical Guide to the Packaging of Electronics: Thermal and Mechanical Design and Analysi
T2  - Assembly Automation
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/20
ER  -