Osprey ce alloys meet market demands

Assembly Automation

ISSN: 0144-5154

Article publication date: 1 December 2002




(2002), "Osprey ce alloys meet market demands", Assembly Automation, Vol. 22 No. 4. https://doi.org/10.1108/aa.2002.03322daf.003



Emerald Group Publishing Limited

Copyright © 2002, MCB UP Limited

Osprey ce alloys meet market demands

Osprey ce alloys meet market demands

Keywords: Materials, Alloys, Electronics

A specially formulated range of controlled expansion (CE) alloys produced by Osprey Metals Ltd is meeting the demands of the electronics industry for high reliability packaging solutions (see Plate 4).

The trend towards faster and higher frequency communications means that electronic component designers face thermal, mechanical and cost barriers with existing, commonly available materials. Common thermal management materials, such as copper or aluminium, have coefficients of thermal expansion (CTE) which are higher than those of the semiconductors, resulting in unacceptable stresses and poor reliability. Other more sophisticated controlled expansion materials are limited by poor thermal conductivity, present health hazards or are prohibitively expensive for most applications.

Plate 4 Stainless steel belts from Belt Technologies suit robotic handling applications

The Osprey Metals CE alloys, developed in association with leading international users, are silicon-aluminium alloys, where the ratio of the two metal constituents can be adjusted to match the thermal expansion of microelectronic devices and substrate materials. They are true alloys, produced by Osprey’s proprietary spray-forming process, and not composites prepared by powder metallurgy, which distinguishes them from Al-SiC (aluminium-siliconcarbide) and copper tungsten (Cu-W).

Key characteristics include a density less than aluminium, high thermal conductivity and high specific stiffness. The alloys are suitable for rapid CNC machining to a fine finish (Ra<0.5 μm), are platable using conventional, industry proven methods and are extremely cost competitive. Comprising a mixture of silicon and aluminium, Osprey CE alloys have excellent thermo mechanical properties, are environmentally friendly, safe to handle and use, and present no disposal problems.

The favourable combination of properties for the Osprey CE materials means that they can be used in a wide range of applications. Uses include RF/Microwave packages, carriers and housings, electro-optical module housings and heat sinks for power modules. Other industrial applications include waveguide components, heating blocks for die bonders, components for inertial systems and injection moulding cavities.

Contact: Osprey Metals Ltd, Millands, Neath SA11 1NJ, UK. Tel: +44 (0)1639 634121; Fax: +44 (0)1639 630100; E-mail: spray.form@spreymetals.co.uk

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