TY  - JOUR
AB  - 
VL  - 26
IS  - 1
SN  - 0954-0911
DO  - 10.1108/SSMT.21926aaa.010
UR  - https://doi.org/10.1108/SSMT.21926aaa.010
AU  - 
PY  - 2014
Y1  - 2014/01/01
TI  - IMAPS Poland 37th International Microelectronics and Packaging ConferenceCPMT Conference, Kraków 23-25 September 2013
T2  - Soldering & Surface Mount Technology
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/16
ER  -