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Experimental measurements of the shear force on surface mount components simulating the wave soldering process

Violeta Carvalho (Mechanical Engineering Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)
Bruno Arcipreste (Mechanical Engineering Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)
Delfim Soares (Mechanical Engineering Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)
Luís Ribas (Bosch Car Multimedia, Braga, Portugal)
Nelson Rodrigues (Mechanical Engineering Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)
Senhorinha Teixeira (ALGORITMI Research center, Production and Systems Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)
José C. Teixeira (Mechanical Engineering Department, University of Minho, Campus de Azurém, 4800-058 Guimarães, Portugal)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 7 June 2021

Issue publication date: 3 January 2022

115

Abstract

Purpose

This study aims to determine the minimum force required to pull out a surface mount component in printed circuit boards (PCBs) during the wave soldering process through both experimental and numerical procedures.

Design/methodology/approach

An efficient experimental technique was proposed to determine the minimum force required to pull out a surface mount component in PCBs during the wave soldering process.

Findings

The results showed that the pullout force is approximately 0.4 N. Comparing this value with the simulated force exerted by the solder wave on the component ( ≅ 0.001158 N), it can be concluded that the solder wave does not exert sufficient force to remove a component.

Originality/value

This study provides a deep understanding of the wave soldering process regarding the component pullout, a critical issue that usually occurs in the microelectronics industry during this soldering process. By applying both accurate experimental and numerical approaches, this study showed that more tests are needed to evaluate the main cause of this problem, as well as new insights were provided into the depositing process of glue dots on PCBs.

Keywords

Acknowledgements

This work was financed by FCT, under the Strategic Project UID/SEM/04077/2020. Additionally, by COMPETE: POCI-01-0145-FEDER-007043; FCT within the Project Scope: UIDB/04436/2020 and FCT within the Project Scope: UID/CEC/00319/2020. Bruno Arcipreste acknowledges the scholarship provided by Bosch Car Multimedia.

Citation

Carvalho, V., Arcipreste, B., Soares, D., Ribas, L., Rodrigues, N., Teixeira, S. and Teixeira, J.C. (2022), "Experimental measurements of the shear force on surface mount components simulating the wave soldering process", Soldering & Surface Mount Technology, Vol. 34 No. 1, pp. 16-23. https://doi.org/10.1108/SSMT-12-2020-0057

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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