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Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies

Leonid Anatolevich Olenev (Plekhanov Russian Academy of Economics, Moskva, Russian Federation)
Rafina Rafkatovna Zakieva (Kazan State Power Engineering University, Kazan, Russian Federation)
Nina Nikolaevna Smirnova (Saint Petersburg Mining University, Sankt-Peterburg, Russian Federation)
Rustem Adamovich Shichiyakh (Kuban State Agrarian University, Krasnodar, Russian Federation)
Kirill Aleksandrovich Ershov (I.M. Sechenov First Moscow State Medical University, Moskva, Russian Federation)
Nisith Geetha (Department of Electrical and Electronics Engineering, Sengunthar Engineering College, Tiruchengode, India)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 22 July 2021

Issue publication date: 3 January 2022

68

Abstract

Purpose

This study aims to present a more accurate lifetime prediction model considering solder chemical composition.

Design/methodology/approach

Thermal cycling and standard creep tests as well as finite element simulation were used.

Findings

The study found lower error in the solder joint lifetime evaluation. The higher the Ag content is, the higher the lifetime is achieved.

Originality/value

It is confirmed.

Keywords

Citation

Olenev, L.A., Zakieva, R.R., Smirnova, N.N., Shichiyakh, R.A., Ershov, K.A. and Geetha, N. (2022), "Accurate composition dependent thermo mechanical lifetime estimation of hour glass type solder joint in electronic assemblies", Soldering & Surface Mount Technology, Vol. 34 No. 1, pp. 8-15. https://doi.org/10.1108/SSMT-12-2020-0055

Publisher

:

Emerald Publishing Limited

Copyright © 2021, Emerald Publishing Limited

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