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Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition

Norliza Ismail (Department of Applied Physics, School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Azman Jalar (Department of Applied Physics, School of Applied Physics, Faculty of Science and Technology, Universiti Kebangsaan Malaysia, Bangi, Malaysia and Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Maria Abu Bakar (Institute of Microengineering and Nanoelectronics (IMEN), Universiti Kebangsaan Malaysia, Bangi, Malaysia)
Nur Shafiqa Safee (Department of Physics, Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Malaysia)
Wan Yusmawati Wan Yusoff (Department of Physics, Centre for Defence Foundation Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Malaysia)
Ariffin Ismail (Faculty of Management and Defence Studies, Universiti Pertahanan Nasional Malaysia, Kuala Lumpur, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 8 July 2020

Issue publication date: 4 January 2021

143

Abstract

Purpose

The purpose of this paper is to investigate the effect of carbon nanotube (CNT) addition on microstructure, interfacial intermetallic compound (IMC) layer and micromechanical properties of Sn-3.0Ag-0.5Cu (SAC305)/CNT/Cu solder joint under blast wave condition. This work is an extension from the previous study of microstructural evolution and hardness properties of Sn-Ag-Cu (SAC) solder under blast wave condition.

Design/methodology/approach

SAC/CNT solder pastes were manufactured by mixing of SAC solder powder, fluxes and CNT with 0.02 and 0.04 by weight percentage (Wt.%) separately. This solder paste then printed on the printed circuit board (PCB) with the copper surface finish. Printed samples underwent reflow soldering to form the solder joint. Soldered samples then exposed to the open field air blast test with different weight charges of explosives. Microstructure, interfacial IMC layer and micromechanical behavior of SAC/CNT solder joints after blast test were observed and analyzed via optical microscope, field emission scanning microscope and nanoindentation.

Findings

Exposure to the blast wave induced the microstructure instability of SAC305/Cu and SAC/CNT/Cu solder joint. Interfacial IMC layer thickness and hardness properties increases with increase in explosive weight. The existence of CNT in the SAC305 solder system is increasing the resistance of solder joint to the blast wave.

Originality/value

Response of micromechanical properties of SAC305/CNT/Cu solder joint has been identified and provided a fundamental understanding of reliability solder joint, especially in extreme conditions such as for military applications.

Keywords

Acknowledgements

The authors are gratefully acknowledged the financial support from Universiti Kebangsaan Malaysia (UKM) under MI-2018-019 grant and Universiti Pertahanan Nasional Malaysia (UPNM) under grant FRGS/1/2015/SG06/UPNM/03/1, and Redring Solder (M) Sdn. Bhd. for research materials and collaboration work.

Citation

Ismail, N., Jalar, A., Abu Bakar, M., Safee, N.S., Wan Yusoff, W.Y. and Ismail, A. (2021), "Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition", Soldering & Surface Mount Technology, Vol. 33 No. 1, pp. 47-56. https://doi.org/10.1108/SSMT-11-2019-0035

Publisher

:

Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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