Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates

Abstract

Purpose

The paper aims to verify the influence of mechanical factors (longitudinal elongation at constant stretching velocity, constant elongation strain and cyclic compressive and tensile stresses) on the electrical properties of thin-film and polymer thick-film resistors on flexible substrates.

Design/methodology/approach

Kapton foil was used as a substrate for all test samples. Designed resistive structures were made with the aid of two polymer thick-film resistive inks or OhmegaPly Ni-P resistive foil. Two different topologies – the horseshoe and triangular – were used. These topologies should have the opposite stability parameters.

Findings

Almost all presented data confirm the influence of the topology of resistors on stability of their electrical properties. The resistive materials applied for test structures also affect the stability under various mechanical exposures.

Originality/value

In general, the largest changes were caused by longitudinal elongation at constant stretching velocity, whereas other tests caused smaller changes of electrical properties. The measurements confirm the influence of topology on stability of electric properties.

Citation

Dziedzic, A., Osypiuk, P. and Steplewski, W. (2017), "Stability of electrical properties for mechanically exposed thick- and thin-film resistors on flexible substrates", Soldering & Surface Mount Technology, Vol. 29 No. 1, pp. 54-58. https://doi.org/10.1108/SSMT-11-2016-0030