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Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies

Muhammad Naqib Nashrudin (School of Mechanical Engineering, Universiti Sains Malaysia – Engineering Campus Seri Ampangan, Nibong Tebal, Malaysia)
Zhong Li Gan (School of Mechanical Engineering, Universiti Sains Malaysia – Engineering Campus Seri Ampangan, Nibong Tebal, Malaysia)
Aizat Abas (School of Mechanical Engineering, Universiti Sains Malaysia – Engineering Campus Seri Ampangan, Nibong Tebal, Malaysia)
M.H.H. Ishak (School of Mechanical Engineering, Universiti Sains Malaysia – Engineering Campus Seri Ampangan, Nibong Tebal, Malaysia)
M. Yusuf Tura Ali (Jabil Circuit Sdn. Bhd., Bayan Lepas Industrial Park, Phase 4, George Town, Malaysia)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 4 February 2020

Issue publication date: 23 April 2020

113

Abstract

Purpose

In line with the recent development of flip-chip reliability and underfill process, this paper aims to comprehensively investigate the effect of different hourglass shape solder joint on underfill encapsulation process by mean of experimental and numerical method.

Design/methodology/approach

Lattice Boltzmann method (LBM) numerical was used for the three-dimensional simulation of underfill process. The effects of ball grid arrays (BGA) encapsulation process in terms of filling time of the fluid were investigated. Experiments were then carried out to validate the simulation results.

Findings

Hourglass shape solder joint has shown the shortest filling time for underfill process compared to truncated sphere. The underfill flow obtained from both simulation and experimental results are found to be in good agreement for the BGA model studied. The findings have also shown that the filling time of Hourglass 2 with parabolic shape gives faster filling time compared to the Hourglass 1 with hemisphere angle due to bigger cross-sectional area of void between the solder joints.

Practical implications

This paper provides reliable insights to the effect of hourglass shape BGA on the encapsulation process that will benefit future development of BGA packages.

Originality/value

LBM numerical method was implemented in this research to study the flow behaviour of an encapsulation process in term of filling time of hourglass shape BGA. To date, no research has been found to simulate the hourglass shape BGA using LBM.

Keywords

Acknowledgements

This work was partly supported by the following grants: Fundamental Research Grant Scheme (FRGS) (Grant number: 203/PMEKANIK/6071428) and Research University (RU) (Grant number: 8014071).

Citation

Nashrudin, M.N., Gan, Z.L., Abas, A., Ishak, M.H.H. and Tura Ali, M.Y. (2020), "Effect of hourglass shape solder joints on underfill encapsulation process: numerical and experimental studies", Soldering & Surface Mount Technology, Vol. 32 No. 3, pp. 147-156. https://doi.org/10.1108/SSMT-10-2019-0028

Publisher

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Emerald Publishing Limited

Copyright © 2020, Emerald Publishing Limited

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