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Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder

Roman Koleňák (Slovak University of Technology, Faculty of Materials Science and Technology, Trnava, Slovak Republic)
Igor Kostolný (Slovak University of Technology, Faculty of Materials Science and Technology, Trnava, Slovak Republic)
Jaromír Drápala (FMMI – Faculty of Metallurgy and Material Engineering, Ostrava, Czech Republic)
Martin Kusý (Slovak University of Technology, Faculty of Materials Science and Technology, Trnava, Slovak Republic)
Matej Pašák (Slovak University of Technology, Faculty of Materials Science and Technology, Trnava, Slovak Republic)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Article publication date: 2 April 2019

Issue publication date: 16 April 2019

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Abstract

Purpose

This study aims to solder AlN ceramics with a Cu substrate using an active type Sn-Ag-Ti solder. Soldering was performed with power ultrasound. The Sn3.5Ag2Ti alloy was first studied.

Design/methodology/approach

It was found to contain a Sn matrix, where both Ag phase – ɛ-Ag3Sn – and Ti phases ɛ-Ti6Sn5 and Ti2Sn3 – were identified. Ti contained in these phases is distributed to the interface with ceramic material. A reaction layer was thus formed. This layer varies in thickness from 0.5 to 3.5 µm and ensures the wettability of an active solder on the surfaces of ceramic materials.

Findings

X-ray diffraction analysis proved the presence of new NTi and AlTi2 phases on the fractured surface. Sn plays the main role in bond formation when soldering the Cu substrate with Sn-Ag-Ti solder. The Cu3Sn and Cu6Sn5 phases, which grow in direction from the phase interface to solder matrix, were found in all cases within the solder/Cu substrate interface. The combination of AlN ceramics/Cu joint maintained a shear strength of 29.5 MPa, whereas the Cu/Cu joint showed a somewhat higher shear strength of 39.5 MPa.

Originality/value

The present study was oriented towards soldering of AlN ceramics with a Cu substrate by the aid of ultrasound, and the fluxless soldering method was applied. Soldering alloy type Sn-Ag-Ti was analysed, and the interactions between the solder and ceramic and/or Cu substrate were studied. The shear strength of fabricated soldered joints was measured.

Keywords

Acknowledgements

This work was supported by the Slovak Research and Development Agency under the contract no. APVV-17-0025. The paper was also prepared with the support of the VEGA 1/0089/17 project: Research of new alloys for direct soldering of metallic and ceramic. The authors thank Associate Professor Ing. Viliam Hrnčiar, CSc, for EDX analysis.

Citation

Koleňák, R., Kostolný, I., Drápala, J., Kusý, M. and Pašák, M. (2019), "Research on soldering AlN ceramics with Cu substrate using Sn-Ag-Ti solder", Soldering & Surface Mount Technology, Vol. 31 No. 2, pp. 93-101. https://doi.org/10.1108/SSMT-10-2018-0039

Publisher

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Emerald Publishing Limited

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