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In–Bi low-temperature SLID bonding for piezoelectric materials

Knut E. Aasmundtveit (IMS-Department of Microsystems, University College of Southeast Norway, Borre, Norway)
Trym Eggen (IMS-Department of Microsystems, University College of Southeast Norway, Borre, Norway and GE Vingmed Ultrasound, Horten, Norway)
Tung Manh (IMS-Department of Microsystems, University College of Southeast Norway, Borre, Norway)
Hoang-Vu Nguyen (IMS-Department of Microsystems, University College of Southeast Norway, Borre, Norway)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 3 April 2018

Abstract

Purpose

This paper aims to demonstrate low-temperature bonding for piezoelectric materials at temperatures well below the relevant Curie temperatures so as to avoid depolarization of the piezoelectric material during bonding.

Design/methodology/approach

Au-coated test samples of lead zirconate titanate (PZT) are bonded to a WC-based resonant backing layer with In–Bi eutectic material in which the In–Bi metal system is a preform or thin, evaporated layers. The bonded samples are characterized using electrical impedance spectroscopy and cross-section microscopy. The first technique verifies the integrity of polarization and reveals the quality of the bondline in a non-destructive manner, particularly looking for voids and delaminations. The latter technique is destructive but gives more precise information and an overview of the structure.

Findings

Successful low-temperature (115°C) bonding with intact PZT polarization was demonstrated. The bondlines show a layered structure of Au/Au–In intermetallic compounds (with Bi inclusions)/Au, capable of withstanding temperatures as high as 271°C before remelting occurs. For bonded samples using In–Bi preform, repeatable bonds of high quality (very little voiding) were obtained, but the bonding time is long (1 h or more). For bonded samples using evaporated thin films of In–Bi, bonding can be performed in 30 min, but the process needs further optimization to be repeatable.

Originality/value

Low-temperature solid-liquid interdiffusion (SLID) bonding is a novel technique, merging the fields of low-temperature solder bonding with the SLID/transient liquid phase (TLP) approach, which is normally used for much higher temperatures.

Keywords

  • Intermetallic compounds
  • Interconnections
  • Assembly
  • Electro-acoustic devices
  • Low-temperature solder
  • SLID bonding

Acknowledgements

The present work was funded by the Research Council of Norway through the NANO2021 program (project number 235302/O70; B-EAM – Advanced Assembly Technologies for Electro Acoustic Module used in Ultrasound Cardiovascular Applications). The Research Council of Norway is also acknowledged for the support to the Norwegian Micro- and Nano-Fabrication Facility, NorFab, project number 245963/F50. The authors thank Zekija Ramic and Anh-Tuan Thai Nguyen, both HSN, for Au electroplating of samples.

Citation

Aasmundtveit, K.E., Eggen, T., Manh, T. and Nguyen, H.-V. (2018), "In–Bi low-temperature SLID bonding for piezoelectric materials", Soldering & Surface Mount Technology, Vol. 30 No. 2, pp. 100-105. https://doi.org/10.1108/SSMT-10-2017-0034

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Publisher

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Emerald Publishing Limited

Copyright © 2018, Emerald Publishing Limited

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