The purpose of this paper is to focus on a description of reliable bonding technique of zero-shrink low-temperature co-fired ceramic (LTCC) and alumina ceramics. LTCC is widely used for manufacturing electrical systems in 3D configuration. LTCC substrates were so far bonded with alumina ceramics using additional adhesive layers with subsequent firing or curing cycle. With the advent of the zero-shrink LTCC substrates, it is now possible to bond unfired substrates with other fired substrates, for example fired LTCC or alumina substrates. Alumina substrate in combination with LTCC brings advantages of good thermal conductivity for usage in heating elements or packaging.
The test structure contains a thick-film pattern for verification of the compatibility of the bonding process. We have used two methods for bonding the substrates: cold chemical lamination (CCL) and thermo compression method, using a dielectric thick-film paste as the adhesive. Optical microscopy, scanning electron microscopy and electric testing of the screen-printed patterns were used for verification of the bonding quality.
The thermo-compression method gave poor results in comparison with the CCL method. The best quality of lamination was achieved at room temperature combined with low pressure for both types of bonding materials. In addition, a possibility of using this bonding method for sensor fabrication was investigated. The ceramic pressure sensor samples with a cavity were created.
The possibility of bonding two different ceramic materials was investigated. A new approach to ceramic bonding showed promising results with possible use in sensors.
Funding for this research work was supported through the grant project of the Czech Ministry of Education for Brno University of Technology FEKT-S-14/2168 “Research of excellent technologies for 3D packaging and interconnection”.
Somer, J., Štekovič, M., Urban, F., Šandera, J. and Szendiuch, I. (2015), "Bonding of zero-shrink LTCC with alumina ceramics", Soldering & Surface Mount Technology, Vol. 27 No. 4, pp. 157-163. https://doi.org/10.1108/SSMT-10-2014-0021Download as .RIS
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