Characterization of nano-enhanced interconnect materials for fine pitch assembly

Yan Zhang (Key Laboratory of Advanced Display and System Applications, School of Mechatronics Engineering and Automation, Ministry of Education & SMIT Center, Shanghai University, Shanghai, China)
Janusz Sitek (Soldering Materials Department, Tele and Radio Research Institute, Warsaw, Poland)
Jing-yu Fan (Shanghai Institute of Applied Mathematics and Mechanics, Shanghai University, Shanghai, China)
Shiwei Ma (Department of Automation, School of Mechatronics Engineering and Automation, Shanghai University, Shanghai, China)
Marek Koscielski (Soldering Materials Department, Tele and Radio Research Institute, Warsaw, Poland)
Lilei Ye (Smart High Tech AB, Göteborg, Sweden)
Johan Liu (SMIT Center, Shanghai University, Shanghai, China and BNSLionano Systems Laboratory, Department of Microtechnology and Nanoscience, Chalmers University of Technology, Gothenburg, Sweden)

Soldering & Surface Mount Technology

ISSN: 0954-0911

Publication date: 28 January 2014

Abstract

Purpose

Multiple fillers are adopted to study the filler influences on electrical and mechanical properties of the conductive adhesives. The performances of the developed nano-enhanced interconnect materials in printing process are also evaluated. The paper aims to discuss these issues.

Design/methodology/approach

Micron-sized silver flakes are used as the basic fillers, and submicro- and nano-sized silver spheres and carbon nanotubes (CNTs) are adopted to obtain conductive adhesives with multiple fillers. Differential scanning calorimetry measurement is carried out to characterize the curing behavior of the samples with different fillers, four-probe method is used to obtain the bulk resistivity, shear test is conducted for adhesive strength, and environmental loading test is also involved. Furthermore, printing trials with different patterns have been carried out.

Findings

The electrical resistivity of the adhesives with submicro-sized silver spheres does not monotonically change with the increasing sphere proportion, and there exists an optimized value for the ratio of silver flakes to spheres. Samples with relatively small amount of CNT additives show improved electrical properties, while their mechanical strengths tend to decrease. For the printing application, the adhesives with 18.3 volume% filler content behave much better than those with lower filler content of 6 percent. The presence of the nano-particles makes a slight improvement in the printing results.

Research limitations/implications

More detailed printing performance and reliability test of the samples need to be carried out in the future.

Originality/value

The conductive adhesives as interconnect materials exhibit some improved properties with optimized bimodal or trimodal fillers. The additive of the nano-fillers affects slightly on the printing quality of the bimodal conductive adhesives.

Keywords

Citation

Zhang, Y., Sitek, J., Fan, J., Ma, S., Koscielski, M., Ye, L. and Liu, J. (2014), "Characterization of nano-enhanced interconnect materials for fine pitch assembly", Soldering & Surface Mount Technology, Vol. 26 No. 1, pp. 12-17. https://doi.org/10.1108/SSMT-10-2013-0033

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Publisher

:

Emerald Group Publishing Limited

Copyright © 2014, Emerald Group Publishing Limited

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