Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering

Abstract

Purpose

The purpose of this paper is to compare the reliability and intermetallic layer (IML) of solder joints prepared with infrared (IR) and vapour phase (VP) soldering. The reliability of 0603-sized resistors’ solder joints formed with IR and VP soldering was investigated. The IML of the joints was analysed based on image processing algorithm automatically.

Design/methodology/approach

For the reliability analyses, the ageing method was a highly accelerated stress test (HAST) with +105°C maximum temperature, fully saturated (100 per cent) relative humidity at +0.5 atm overpressure. The joints were characterised based on the thickness of their IML and on their shear strength in as-reflowed stage, and after 400, 800, 1,200, 1,600 and 2,000 hours of HAST. An image processing algorithm was developed to measure the thickness of the IMLs on cross-sectional scanning electron microscopy (SEM) images automatically.

Findings

The increase of the IML thickness is lower in the case of HAST ageing compared to other methods. The thickness increment of the Cu₆Sn₅ layer was higher for IR and lower for VP soldering; the Cu₃Sn layer cannot be inspected even after 2,000 hours of HAST ageing. The results of shear strength measurements show better reliability for VP soldered joints.

Practical implications

The developed image processing method is applicable to obtain quantitative results about the IMLs in an effective fast way.

Originality/value

There is a lack of information in the literature regarding the reliability comparison of solder joints formed with VP and conventional reflow processes. Thus, we performed research about the lifetime of solder joints formed with VP and IR reflow method.

Citation

Krammer, O. (2014), "Comparing the reliability and intermetallic layer of solder joints prepared with infrared and vapour phase soldering", Soldering & Surface Mount Technology, Vol. 26 No. 4, pp. 214-222. https://doi.org/10.1108/SSMT-09-2013-0023